Chiếc chip Flip hoàn toàn tự động Die Bonder Transistor Die Bonding Machine Máy liên kết bán dẫn Die Bonding Machine

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September 01, 2025
Category Connection: chọn và đặt máy
Brief: Discover the Fully Automatic Flip Chip Die Bonder Machine, designed for high-speed semiconductor packaging and COB strip light applications. This advanced machine offers precision, efficiency, and versatility for your production needs.
Related Product Features:
  • Utilizes dual swing arms for 180° cross-bonding, enhancing efficiency.
  • Compatible with printers for versatile in-line process solutions.
  • Fully integrated carrier system from loading to die bonding and placement.
  • Supports 0.5M materials with mid-process transfers via docking station.
  • Features automatic calibration and a quick-release workbench for convenience.
  • High-speed die attach with ≥60ms UPH and 60K/h production capacity.
  • Precision positioning with ±1 mil accuracy and ±1° angle accuracy.
  • Equipped with crystal loss and solid leakage detection functions.
Câu hỏi thường gặp:
  • What is the production capacity of the Fully Automatic Flip Chip Die Bonder Machine?
    The machine offers a production capacity of ≥60ms UPH and 60K/h, depending on wafer and substrate size and process requirements.
  • What are the key applications of this die bonder machine?
    It is primarily used for COB flexible lamps in smart home, intelligent lighting, car decoration, and intelligent decoration applications, as well as for flip-chip products solid crystal.
  • Does the machine include any detection functions?
    Yes, it features crystal loss detection and solid leakage detection functions, both using vacuum detection mode for accuracy.